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Hot Chips 2026: SK hynix pushes hybrid bonding to HBM5 as AI memory hits 775-micron ceiling — firm extends MR-MUF through Nvidia Rubin

Tom's HardwareAugust 25, 2026 at 1:55 AM

NEWS SUMMARY

What changed

The problem, per SK, is that HBM cubes are capped at a total thickness of 775 microns, the standard thickness of a 300mm logic wafer.

MEMORY IMPACT

Why it matters

This Supply update does not yet create a clear sector direction. It may still change supply-demand assumptions, but the evidence is insufficient on its own to lift or reduce memory pricing and earnings expectations.

Evidence behind the label

HBMAI memory

Rule confidence62%

This page provides a short source summary and a rule-based interpretation. Machine translation may miss context, so verify the original. Direction labels estimate potential effects on memory supply, demand, pricing or earnings and are not stock recommendations.