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Hot Chips 2026: SK hynix pushes hybrid bonding HBM5 as AI memory hits 775-micron ceiling — firm extends MR-MUF through Nvidia Rubin
Tom's Hardware
NEWS SUMMARY
What changed
The problem, per SK, is that HBM cubes are capped at a total thickness of 775 microns, the standard thickness of a 300mm logic wafer.
MEMORY IMPACT
Why it matters
This Supply update does not yet create a clear sector direction. It may still change supply-demand assumptions, but the evidence is insufficient on its own to lift or reduce memory pricing and earnings expectations.
Evidence behind the label
HBMAI memory
Rule confidence62%
This page provides a short source summary and a rule-based interpretation. Machine translation may miss context, so verify the original. Direction labels estimate potential effects on memory supply, demand, pricing or earnings and are not stock recommendations.