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SK hynix’s technology roadmap for co-packaged optics features in ‘Nature Electronics,’ as AI competition shifts from chips to systems

SK hynix Newsroom

NEWS SUMMARY

What changed

▪ SK hynix has collaborated with leading global researchers to publish a roadmap for co-packaged optics (CPO), a key technology for next-generation AI infrastructure, in the prestigious scientific journal “Nature Electronics.” ▪ Extending beyond HBM innovation, the paper presents a

MEMORY IMPACT

Why it matters

This Product update does not yet create a clear sector direction. It may still change supply-demand assumptions, but the evidence is insufficient on its own to lift or reduce memory pricing and earnings expectations.

Evidence behind the label

HBM
Rule confidence62%

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